History

Nanotronix has developed various 2D/3D fine patterning using glass as a substrate, and has experience in developing both TSV and TGV through-hole electrodes.

Currently, we are focusing on developing plating total solution (pretreatment, seed & fill) for TGV metallization of large glass substrates.

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2009TSV metallization(seed plating)

  • - >Ø 10µm
  • - Process tools development
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2015CIS pan-out @ glass

  • - Sputter seed base
  • - Build-up Plating
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2019micro-LED TFT edge patterns (ink. Embedded : > 20µm)

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2022 Glass PCB (signage, etc.)
Direct patterning on the glass for outdoor signage

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2022~TGV metallization(seed plating)

  • - Adhesive layer
  • - Seed layer(Ni/Cu)
  • - All layers by plating process